A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts

The application of adhesively bonded joints in aerospace structural parts has increased significantly recent years and the general advantages their use are well-documented. One disadvantages adhesive bonding is relevant permanence, when compared to traditional mechanical fastening. End-of-life processes generally require separation adherents for repair or recycling, usually achieve this, they combine large forces with a high temperature, thus damaging adherents, while consuming amounts energy. In this work, novel disassembly technique based on laser-induced shock waves proposed multi-material structures. laser can generate tensile stresses that able break joint, being localized enough avoid involved adherents. process applied specimens made from 3D-woven CFRP core thin Ti layer, which common assembly used state-of-the-art aircraft fan blades. experimental been progressively developed. First, single-sided shot applied, particle velocity measured at back face material. This method proves ineffective damage creation led symmetric configuration, so stress be controlled focused bond line. approach proved capable generating debonding between propagating it by moving spot. Qualitative assessment created during indicates as material method.